Plasma

Atmospheric pressure plasma can be used for surface treatment and etch applications in various industries such as glass, display, semiconductor, PCB, printing, coating, etc. Enjet has developed patented RF plasma head, based on precise fluidic control technology, which can allow plasma ignition even on 7 mm distance. The conventional RF plasma head can make ignition only within 2 mm distance. It is very important in real process because of irregular flatness of the samples.

 
 

Plasma mechanism

 

What is argon plasma?

 

Ar plasma is one of the most common types of plasma used for cleaning due to its low cost, antioxidant capability and wide availability. It can be supplied easily. All systems available in Plasma Etch work in most gas and gas combinations as well as in argon gas.

Ar Plasma PE-75 Argon Plasma in a Plasma Cleaner Argon is commonly used with oxygen to clean metal or non-metallic materials. Argon is also useful for removing organics without deforming the surface being treated. It can also be used to remove some non-organics when running on your own.

The Ar plasma cleans the surface of the plastic sample but is not etched (surface material removal). Plasma removes all traces of organic material and leaves no residue unless the sample has inorganic contaminants. All contaminants that are removed are pumped out of the chamber by a vacuum system. Argon plasma is used in many metal cleaning applications, including wire bonding, because it does not oxidize the surface. Argon is the most commonly used gas for wire bonding applications.

Other uses of argon for plasma

 

Argon is often mixed with oxygen when cleaning metal substrates. This mixture is widely used for surface activation before bonding. Argon atoms prevent oxygen atoms from oxidizing most metal surfaces. Oxygen is a highly reactive and ideal gas for surface activation, but tends to oxidize metals. Argon prevents oxidation of the surface when the plasma destroys the oxygen bond with the metal surface and transports it out of the chamber. Argon is also used after etching (removing material) with CF4 (or CF4 / O2 mixture). Argon cleans the residues and removes the harsh gases before the technician handles the products to be processed.

Plasma cleaning is one of the widely used methods for surface cleaning of substrates in material research and device manufacturing. Samco plasma cleaners are available for both R & D and production. Our desktop plasma cleaners have a small footprint and can batch process samples / wafers using multiple shelves. H2O-based plasma cleaners offer unique process solutions for polymer surface treatment / bonding and copper / silver electrode cleaning. Our large chamber or magazine-plasma cleaners are suitable for back-end cleaning processes in device manufacturing.